54.Semiconductor Manufacturing by John G. Webster (Editor)

By John G. Webster (Editor)

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The full development of the laminar flow profile in the reactor requires that this boundary layer grow across the reactor diameter. This development requires a certain length of reactor that depends on the gas properties, pressure, velocity, and composition. The provision required for a welldeveloped and stable fluid flow behavior is a critical design consideration for many reactor designs. MIXED CONVECTION PHENOMENA The superimposition of buoyancy-driven flows due to gasphase density gradients, resulting from temperature gradients as well as compositional variations on the forced flow entering the reactor leads to a mixed convection type of flow.

Evolving Fuzzy Rules for Due-Date Assignment Problem in Semiconductor Manufacturing Factory. J. Intel. Manufactur. 2005, 16, pp 549– 557. 22. Fargher, H. ; Kilgore, M. ; Kline, P. ; Smith, R. A. A Planner and Scheduler for Semiconductor Manufacturing. IEEE Trans. Semiconductor Manufactur. 1994, 7, pp 117–126. Artificial Intelligence in Semiconductor Manufacturing 23. Yang, T. ; Tsai, T. N. Modeling and Implementation of a Neurofuzzy System for Surface Mount Assembly Defect Prediction and Control.

Phi-scatterometry for Integrated Linewidth and Process Control in DRAM Manufacturing. IEEE Trans. Semiconductor Manufactur. 2002, 15, pp 470–477. ; Pelagagge, P. M. Use of Neural Networks in Modeling Relations Between Exposure Energy and Pattern Dimension in Photolithography Process [MOS ICs]. IEEE Trans. Components, Packaging, Manufactur. Technol. C 1996, 19, pp 290–299. Choi, J. ; Do, H. M. A Learning Approach of Wafer Temperature Control in a Rapid Thermal Processing System. IEEE Trans. Semiconductor Manufactur.

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